A must-see for those who want to eliminate variations in plating thickness between substrates! Rack plating.
Our unique belt conveyor system for fully automated plating results in very minimal variation in plating thickness between substrates.
Our company offers manual plating lines using racks for various substrates, as well as fully automated plating lines utilizing our unique belt conveyor system. For IC lead frames, we utilize a fully automated rackless plating line. The fully automated plating line with our unique belt conveyor system aims to reduce labor by automating the loading and unloading of substrates and IC lead frames. Additionally, our fully automated plating process with the unique belt conveyor system has very minimal variation in plating thickness between substrates. 【Features】 ■ Manual plating lines using racks and our unique fully automated plating lines with belt conveyors for various substrates ■ Fully automated rackless plating line for IC lead frames *For more details, please refer to the PDF document or feel free to contact us.
- Company：立山電化工業
- Price：Other
